{"id":15,"date":"2018-05-24T16:37:00","date_gmt":"2018-05-24T16:37:00","guid":{"rendered":"https:\/\/physlabs.colostate.edu\/lithography\/?page_id=15"},"modified":"2018-06-27T22:45:34","modified_gmt":"2018-06-27T22:45:34","slug":"specifications","status":"publish","type":"page","link":"https:\/\/physlabs.colostate.edu\/lithography\/specifications\/","title":{"rendered":"Specifications"},"content":{"rendered":"<figure id=\"attachment_214\" aria-describedby=\"caption-attachment-214\" style=\"width: 300px\" class=\"wp-caption alignright\"><img loading=\"lazy\" decoding=\"async\" class=\"size-medium wp-image-214\" src=\"https:\/\/physlabs.colostate.edu\/lithography\/wp-content\/uploads\/sites\/11\/2018\/06\/DSC01142-300x200.png\" alt=\"\" width=\"300\" height=\"200\" srcset=\"https:\/\/physlabs.colostate.edu\/lithography\/wp-content\/uploads\/sites\/11\/2018\/06\/DSC01142-300x200.png 300w, https:\/\/physlabs.colostate.edu\/lithography\/wp-content\/uploads\/sites\/11\/2018\/06\/DSC01142-768x512.png 768w, https:\/\/physlabs.colostate.edu\/lithography\/wp-content\/uploads\/sites\/11\/2018\/06\/DSC01142.png 1024w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><figcaption id=\"caption-attachment-214\" class=\"wp-caption-text\">The objective lenses of the LW405C. The red illumination inside the machine enclosure prevents the premature exposure of photoresist.<\/figcaption><\/figure>\n<p>The LW405C is a high-performance solution for planar patterning directly on a mask or final substrate.\u00a0 The machine is ideal for rapid\u00a0 prototype fabrication and low-volume production.\u00a0 The laser writer is designed for fully automatic operation, requiring only limited user operation, or it be operated in manual mode for writing and metrology.\u00a0 Patterns can be easily aligned to pre-existing features.<\/p>\n<p>The unit is incredibly flexible and is suited for any size substrate or mask up to 150\u00a0x\u00a0150\u00a0mm (or larger with limited travel), with a writable area of 100\u00a0x\u00a0100\u00a0mm.\u00a0 Mounting chuck stops allow for consistent alignment of 2, 3, and 4-inch wafers, with the ability to add custom stops or templates for substrates of any size or shape.\u00a0 Substrates as small as 4 x 4 mm can be used with the current vacuum chuck; smaller substrates can be patterned but cannot be vacuum anchored with the current chuck.<\/p>\n<p>If you have an idea and would like to discuss feasibility and possibly try it out, please contact us.<\/p>\n<ul>\n<li><strong>Exposure Lasers<\/strong>\n<ul>\n<li>405\u00a0nm GaN laser diode, variable 60-100\u00a0mW\n<ul>\n<li>Used for patterning positive photoresists such as AZ and Shipley S1800 resists<\/li>\n<li>Can be used to pattern thin (&lt;\u00a010\u00a0\u00b5m) negative photoresist, such as SU8<\/li>\n<\/ul>\n<\/li>\n<li>375\u00a0nm GaN laser diode, 50\u00a0mW\n<ul>\n<li>Used for optimal patterning of SU8<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<li><strong>Multiple Patterning Styles<\/strong>\n<ul>\n<li>Binary patterns for traditional lithography<\/li>\n<li>Multilevel patterning (256\u00a0level) for 3D structure fabrication (grayscale lithography)<\/li>\n<\/ul>\n<\/li>\n<li><strong>Four Write Modes<\/strong>\n<ul>\n<li>Beam raster scan (any geometry, binary or multilevel)<\/li>\n<li>Stage raster scan (large multilevel patterns at high resolution)<\/li>\n<li>Vector (straight lines written with beam spot size)<\/li>\n<li>Contour (lines and arcs written with beam spot size)<\/li>\n<\/ul>\n<\/li>\n<li><strong>Write field<\/strong>\n<ul>\n<li>100\u00a0x\u00a0100\u00a0mm writeable area on substrates up to 150\u00a0x\u00a0150\u00a0mm<\/li>\n<li>XYZ interferometric stages with 10\u00a0nm resolution<\/li>\n<\/ul>\n<\/li>\n<li><strong>Focusing<\/strong>\n<ul>\n<li>Interference ring optical autofocus<\/li>\n<li>Plane and sphere focus surfaces<\/li>\n<\/ul>\n<\/li>\n<li><strong>Optics and Imaging<\/strong>\n<ul>\n<li>Automatic lens change system<\/li>\n<li>Four standard lenses and a special UV lens for 375\u00a0nm laser.\n<ul>\n<li>Lens 2: ~6.4\u00a0\u00b5m beam, 0.8-4\u00a0\u00b5m positioning, 120-450\u00a0mm\u00b2\/min<\/li>\n<li>Lens 3: ~3.2\u00a0\u00b5m beam, 0.4-2\u00a0\u00b5m positioning, 30-120\u00a0mm\u00b2\/min<\/li>\n<li>Lens 4: ~1.6\u00a0\u00b5m beam, 0.2-0.8\u00a0\u00b5m positioning, 8-30\u00a0mm\u00b2\/min<\/li>\n<li>Lens 5: ~0.8\u00a0\u00b5m beam, 0.1-4\u00a0\u00b5m positioning, 2-8\u00a0mm\u00b2\/min<\/li>\n<li>Lens 6: ~5.0 \u00b5m beam, 0.6-3 \u00b5m positioning, 70-270\u00a0mm\u00b2\/min (375\u00a0nm laser only)<\/li>\n<\/ul>\n<\/li>\n<li>B&amp;W digital video camera\n<ul>\n<li>Red light (640\u00a0nm) illumination<\/li>\n<li>0.2\u00a0\u00b5m optical resolution<\/li>\n<li>100\u00a0\u00b5m, 200\u00a0\u00b5m, 400\u00a0\u00b5m, and 800\u00a0\u00b5m fields of view<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n<li><strong>Alignment<\/strong>\n<ul>\n<li>Automated substrate centering<\/li>\n<li>Align patterns with existing features on the front or back side of the substrate<\/li>\n<li>Frontside alignment tolerance: &lt;\u00a01\u00a0\u00b5m<\/li>\n<li>Backside alignment tolerance:\u00a0\u00b1\u00a02\u00a0\u00b5m<\/li>\n<li>Seven alignment modes, including direction only for matching wafer crystal directions<\/li>\n<\/ul>\n<\/li>\n<li><strong>Other features<\/strong>\n<ul>\n<li>Write time calculator<\/li>\n<li>Multiple, customizable vacuum chucks<\/li>\n<li>Full dose control in mJ\/cm\u00b2<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>The LW405C is a high-performance solution for planar patterning directly on a mask or final substrate.\u00a0 The machine is ideal for rapid\u00a0 prototype fabrication and low-volume production.\u00a0 The laser writer &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/physlabs.colostate.edu\/lithography\/specifications\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Specifications&#8221;<\/span><\/a><\/p>\n","protected":false},"author":38,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","footnotes":""},"class_list":["post-15","page","type-page","status-publish","hentry"],"taxonomy_info":[],"featured_image_src_large":false,"author_info":{"display_name":"demann","author_link":"https:\/\/physlabs.colostate.edu\/lithography\/author\/demann\/"},"comment_info":0,"_links":{"self":[{"href":"https:\/\/physlabs.colostate.edu\/lithography\/wp-json\/wp\/v2\/pages\/15","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/physlabs.colostate.edu\/lithography\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/physlabs.colostate.edu\/lithography\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/physlabs.colostate.edu\/lithography\/wp-json\/wp\/v2\/users\/38"}],"replies":[{"embeddable":true,"href":"https:\/\/physlabs.colostate.edu\/lithography\/wp-json\/wp\/v2\/comments?post=15"}],"version-history":[{"count":19,"href":"https:\/\/physlabs.colostate.edu\/lithography\/wp-json\/wp\/v2\/pages\/15\/revisions"}],"predecessor-version":[{"id":216,"href":"https:\/\/physlabs.colostate.edu\/lithography\/wp-json\/wp\/v2\/pages\/15\/revisions\/216"}],"wp:attachment":[{"href":"https:\/\/physlabs.colostate.edu\/lithography\/wp-json\/wp\/v2\/media?parent=15"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}